| 摘要 |
<p>PURPOSE: To provide a semiconductor device package capable of normally operating a semiconductor integrated circuit chip for a long period of time, by hermetically housing the semiconductor integrated circuit chip in an insulation package composed of an insulation substrate and a cover without causing deterioration in characteristics of the semiconductor integrated circuit chip. CONSTITUTION: A semiconductor device package hermetically houses therein a semiconductor chip 3 by providing an external lead terminal 7 between an insulation substrate 1 and a cover 2, and then joining the insulation substrate 1, the cover 2 and the external lead terminal 7 by glass members 5, 6. The glass members 5, 6 are made of glass produced by adding 30.0-50.0% by weight of willemite compound as a filler to glass components containing 40.0-60.0% by weight of lead oxide, 5.0-15.0% by weight of bismuth oxide, 2.0-8.0% by weight of boron oxide and 1.0-5.0% by weight of copper oxide.</p> |
