发明名称 RESIN SEALED SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE: To regulate the interval between an island and an insulating member by forming an island having larger diameter than a semiconductor pellet and forming a protrusion protruding from the island toward an insulation member at a position surrounding the semiconductor pellet. CONSTITUTION: In the semiconductor device, an island 12 has outer diameter larger than the diameter of opening in a frame body 17 and a protrusion 21 is formed toward the frame body 17 at a part where the frame body 17 overlaps the island 12. Resin flow is deflected by the protrusion 21 and no air is left between the island 12 and the frame body 16 or only a small quantity of air is left thereat. Furthermore, since the interval between the island 12 and the frame body 17 is regulated by the protrusion 21, the frame body 17 is protected against deformation even if an undue pressure is applied at the time of resin molding. This structure prevents a beam lead from approaching closely or touching the semiconductor pellet thus preventing deterioration of breakdown strength or short circuit failure.</p>
申请公布号 JPH08115943(A) 申请公布日期 1996.05.07
申请号 JP19940246638 申请日期 1994.10.13
申请人 NEC KANSAI LTD 发明人 EGUCHI TAKAHIRO
分类号 H01L21/60;H01L21/56;H01L23/50;(IPC1-7):H01L21/60 主分类号 H01L21/60
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