发明名称 Thermoelectric module having reduced spacing between semiconductor elements
摘要 An improved thermoelectric module is described. A first electrically conductive pattern is defined on a first substrate and a second electrically conductive pattern is defined on a second substrate. Alternating bars of a first thermoelectric material and a second thermoelectric material are arranged parallel to each other. The bars are fixed into place on the first conductive pattern by an effective thermal and electrical connection with the conductive pattern. One such connection means is soldering. Then the bars are separated into elements. The second substrate is positioned over the elements and fixed to the elements to complete the manufacture of the TEM.
申请公布号 US5515238(A) 申请公布日期 1996.05.07
申请号 US19950395258 申请日期 1995.02.28
申请人 FRITZ, ROBERT E.;MONKOWSKI, JOSEPH R. 发明人 FRITZ, ROBERT E.;MONKOWSKI, JOSEPH R.
分类号 F25B21/02;H01L35/32;(IPC1-7):H05K7/20 主分类号 F25B21/02
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