| 摘要 |
An outer-lead bonding apparatus according to the present invention comprises: (1) a punching die to stamp out chips from a film carrier tape, (2) a mounter to mount TAB chips on a substrate, (3) a first cover to enclose the mounter, (4) a second cover to enclose the punching die, (5) a pressure regulator to supply higher air pressure than outer air into inside space of the first cover, and (6) a exhaust to exhaust air from inside space of the second covering means. The outer-lead bonding apparatus of this invention keeps the environment around the mounter clean with air supplied from a pressure regulator and also by exhausting the air polluted by the punching operation through the exhaust. Neither products nor outer environment is thus contaminated.
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