| 摘要 |
PURPOSE: To obtain a heat bonding composite tape, suitable for producing LSI packaging members and enabling the simplification of a packaging process, improvement, etc., in reliability by forming thin thermoplastic polyimide resin layers on both surfaces of a nonthermoplastic polyimide resin film. CONSTITUTION: This product is obtained by forming melt-bonding layers respectively comprising thin layers 12 and 13 of a thermoplastic polyimide resin(TPI) on both surfaces of a thin film 11 of a nonthermoplastic polyimide resin(NTPI). The TPI preferably has 1×10<2> to 1×10<9> dyne/cm<6> elastic modulus at 200-450 deg.C. The NTPI preferably has 1×10<10> to 1×10<11> dyne/cm<2> elastic modulus at normal temperatures and >=1×10<9> dyne/cm<2> elastic modulus at 200-450 deg.C. Furthermore, the TPI in the layer 12 and TPI in the layer 13 different in characteristics in bonding such as fluid characteristics are preferably used from aspects of reliability, etc., in successively bonding both surfaces. |
