Method for packing a measured quantity of thermosetting resin intended for encapsulating a componentpacking obtained using this method method for operating a mould and mould for carrying out this method

摘要

Method for packing a measured quantity of thermosetting resin (2), intended for encapsulating a component such as an integrated circuit by introducing this quantity into a flexible plastics covering (6a, 6b) which can be sealed airtight, and packing for a measured quantity of thermosetting plastic intended for encapsulating a component, obtained using this method.