Halbleiteranordnung des Harzverkapselungstyps.

摘要

A resin seal type semiconductor device comprises a lead frame (21) having a support (33) and a plurality of leads (43), a semiconductor chip (51) mounted on the die support (33) and having a plurality of pads (52) connected to the leads (43). Furthermore, the device has a wire lead (46) arranged above the semiconductor chip (51). For example, power source is supplied from the lead (43 ) supplying power source to one of the pads (52 ) receiving power source, by connecting the lead (43 ) and the one pad (52 ). Furthermore, power source is supplied from the lead (43 ) to another pad (52 ) located far from the one pad (52 ) by connecting the lead (43 ) and the another pad (52 ) through the wire lead (46).