Versiegelte Flip-Chip-Halbleiteranordnung

摘要

A semiconductor device including a substrate having terminals (1) for electrical connection to the outside, a semiconductor chip (2a) mounted on the substrate by employing a flip chip process, and a synthetic resin (4) for sealing the substrate and the semiconductor chip in the semiconductor device, wherein the semiconductor device includes a metallic pattern (21) rectangularly formed on the functional surface of the semiconductor chip to completely surround the functional region on the semiconductor chip and a metallic pattern (51) rectangularly formed on the substrate corresponding to the metallic pattern on the semiconductor chip, and that a gap between the semiconductor chip and the substrate is airtightly sealed with both the metallic patterns by connecting both the metallic patterns to each other when the semiconductor chip is mounted on the substrate.