Kunststoffummantelte Halbleiteranordnung.

摘要

A plastic mold semiconductor device comprises a semiconductor chip (100); a die pad (101A,101B) which is made of a thin metallic plate for supporting the semiconductor chip (100), leads (106) which surround the die pad (101A,101B), wires (105) for connecting electrodes (104) on top of the semiconductor chip (100)and the leads (106); and plastic mold (108) for sealing the entire device; the die pad (101A,101B) being comprised of support sections (101A,101B) separated by a fixed gap from a sub-element interconnecting member (102) which is insulated from the semiconductor chip (100), and connection between the power source or signal related lead (110) and the electrode (20) which is on top the semiconductor chip (100) and is located from the power source or signal related lead (110) is connected by the sub-element interconnecting member (102).