<p>An electrostatic chuck 8 assembly includes, from top to bottom: a top multilayer ceramic insulating layer 10; an electrostatic pattern layer 12 having a conductive electrostatic pattern 16 disposed on a multilayer ceramic substrate; a multilayer ceramic support layer 20; and, a heat sink base 30 having a backside cooling channels machined therein. Layers 12, 12 and 20 are bonded together using multilayer ceramic techniques and the heatsink base 30 is brazed to the bottom of the multilayer ceramic support layer 20.</p>
申请公布号
EP0582566(B1)
申请公布日期
1996.05.01
申请号
EP19910915963
申请日期
1991.08.01
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
LOGAN, JOSEPH, SKINNER;RUCKEL, RAYMOND, ROBERT;TOMPKINS, ROBERT, ELI;WESTERFIELD, ROBERT, PETER, JR.