Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste

摘要

A heat-resistant resin paste consisting essentially of a first organic liquid (A1), a second organic liquid (A2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid (A1) and the second organic liquid (A2), and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid (A1) but insoluble in the second organic liquid (A2), the first organic liquid (A1), the second organic liquid (A2), and the heat-resistant resin (B) being brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.