| 摘要 |
<p>An insulating masking layer 12' with a predetermined pattern is formed on an electrically conductive substrate 11, at least the surface of which is conductive, and an electrically conductive layer 14 and an insulating resin layer 15 are laid in lamination on exposed portions of the conductive surface of the electrically conductive substrate 11, thus preparing a transferring original plate 10. A step of transferring the wiring pattern layer consisting of the electrically conductive layer 14 and the insulating resin layer 15 formed on the transferring original plate 10 onto a substrate 2 for multi-layer printed-wiring board is sequentially repeated with a plurality of transferring original plates 10. By this procedure, wiring patterns 3, 4, 5, <...> in multiple layers are formed on the substrate 2 for multi-layer printed-wiring board. Each wiring pattern 3, 4, 5, <...> is composed of an electrically conductive layer 3a, 4a, 5a, <...> and an insulating resin layer 3b, 4b, 5b, <...> . <IMAGE></p> |
