| 摘要 |
<p>The device includes hardened conductor solids (52) with a matrix of fused end materials (44,54) formed in a polymer material, to form a microconnector matrix. The formation steps consist of depositing a fusible material layer, followed by a polymer. The fusible material layer and polymer are re-heated to form a fused structure. An extra layer is then formed, and photolithography carried out to form a hole structure. Conductor material is then added to the holes, and the material heated to form the outer hole fused section, and peel away the lower outer level.</p> |
