Semiconductor power component

摘要

Semiconductor power component having a disc-shaped semiconductor body (1) whose first principal face (3) and second principal face (6) are each joined in a materially continuous manner to a substrate disc (4, 5) using a low-temperature joining method. The edges of the two substrate discs are sheathed by injection moulding in a plastic casing (13) or the unit consisting of the semiconductor body and the substrate discs is disposed in a container of an evaporatively cooled system in such a way that it is surrounded by the liquid, electrically insulating medium of the same.