发明名称 METHOD OF LAMINATE MANUFACTURE
摘要 PCT No. PCT/GB94/01519 Sec. 371 Date May 1, 1996 Sec. 102(e) Date May 1, 1996 PCT Filed Jul. 13, 1994 PCT Pub. No. WO95/02509 PCT Pub. Date Jan. 26, 1995A laminate such as a PCB material is formed by stacking resin impregnated prepreg sheets (10) between copper foils (12), applying heat and pressure around the periphery of the stack to form an edge-sealed unit, and subjecting a number of such units to a lay-up process in a separate clean area into which they are introduced via surface-cleaning means.
申请公布号 EP0708707(A1) 申请公布日期 1996.05.01
申请号 EP19940920562 申请日期 1994.07.13
申请人 TEKNEK ELECTRONICS LIMITED 发明人 HAMILTON, SHEILA;CANNON, ROY;ROBERTSON, STEWART;KENNETT, JONATHAN
分类号 B32B37/00;B32B37/02;B32B37/18;B32B38/00;H05K3/02;(IPC1-7):B32B31/00;B32B31/20;B32B15/08 主分类号 B32B37/00
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