发明名称 |
METHOD OF LAMINATE MANUFACTURE |
摘要 |
PCT No. PCT/GB94/01519 Sec. 371 Date May 1, 1996 Sec. 102(e) Date May 1, 1996 PCT Filed Jul. 13, 1994 PCT Pub. No. WO95/02509 PCT Pub. Date Jan. 26, 1995A laminate such as a PCB material is formed by stacking resin impregnated prepreg sheets (10) between copper foils (12), applying heat and pressure around the periphery of the stack to form an edge-sealed unit, and subjecting a number of such units to a lay-up process in a separate clean area into which they are introduced via surface-cleaning means. |
申请公布号 |
EP0708707(A1) |
申请公布日期 |
1996.05.01 |
申请号 |
EP19940920562 |
申请日期 |
1994.07.13 |
申请人 |
TEKNEK ELECTRONICS LIMITED |
发明人 |
HAMILTON, SHEILA;CANNON, ROY;ROBERTSON, STEWART;KENNETT, JONATHAN |
分类号 |
B32B37/00;B32B37/02;B32B37/18;B32B38/00;H05K3/02;(IPC1-7):B32B31/00;B32B31/20;B32B15/08 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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