| 摘要 |
PURPOSE: To decide whether the bonding state of wire is good or not by comparing the image at a wire bonded part, picked up by a pickup means, with a reference data related to the bonding state stored in a memory means. CONSTITUTION: An image pickup means 3 picks up the image at a bonding part 14 of a wire 13. An image processing computer 4 processes the image thus picked up to determine the collapse width W at the bonding part 14 which is then delivered, as a processed data, to a comparing section 5. A memory 6 stores an allowable range of the collapse width W at the bonding part, a profile pattern at the bonding part 14 under a suitable bonding state, etc. The comparing section 5 compares the collapse width W with a reference data of collapse width registered in the memory 6 and when the collapse width W is within the allowable range of reference data, a decision is made that the bonding state is good and a decision result is delivered to a marking unit 8. This system can decide whether the bonding state of wire is good or bad. |
