METHOD OF RE-ETCHING SUBSTRATE SURFACE OF HIGH DENSE INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To avoid undesirable redeposition by a method, wherein an etching product isolated at a time of re-etching a holding part is formed so as not to generate interceptions. SOLUTION: In a holding ring 2, there are provided at least three finger- shaped holding parts reaching an edge part of a substrate 1. Etching gas/an etching product passing through the holding part or flowing therebetween are accurately deposited outside a surface of the substrate 1. It is possible to avoid interception operations which may deposit an undesirable etching product in the holding part by a shape of the holding part, such that an end part on a substrate side is tapered or rounded into an arc-form. Thereby, undesirable redeposition can be avoided.