| 摘要 |
PURPOSE: To greatly improve the jointing property of bonding without failing the radiating property of a semiconductor device in a resin packaging type semiconductor device that is provided with a heat sink. CONSTITUTION: For example, a heat sink 14 is arranged on the outside of a bed 13 on which a semiconductor chip 11 is mounted, with a clearance. A suspending pin 15 is bent by depressing so that the heat sink 14 may be located higher than the bed 13. A lead frame 17 is fixed on the bottom face of the heat sink 14 by using a thermoplastic tape 16. Then, inner leads 17a are connected with the pads 11a on the chip 11 individually with an Au wire 18 and the periphery thereof is packaged by a resin 19. Thus, since the tape 16 is not prepared just under the bonding point of the leads 17a, stable bonding can be carried out without being affected by an insulating tape. |
