| 摘要 |
PURPOSE: To obtain a semiconductor device in which the inspection is facilitated for the unit of package by realizing an easily repairable small chip carrier structure, the mounting process is facilitated without limiting the high power wire bonding position, and a small-sized high density device is realized by reducing the bare chip mounting area. CONSTITUTION: A semiconductor element 101 is bonded onto a substrate 104 and the electrode part of the semiconductor element 101 is connected electrically through a wire with the wiring part 105b on the substrate 104. A ring disposed around the semiconductor element 101 is then filled with a specified substance 109 to seal the semiconductor element 101 thus producing a semiconductor device. In such semiconductor device, the ring is a conductive ring 111 which is connected through a wire 102 with the electrode part of the semiconductor element 101. |
