| 摘要 |
PURPOSE: To prevent a resin from being peeled off from a lead frame due to temperature cycle, etc., in a package of LOC structure and to eliminate the breakage of a bonding wire due to cracks caused thereby. CONSTITUTION: A semiconductor chip is adhered and fixed on the rear face of a lead frame with an insulation layer 5 in between and a bonding part 6 on the tip of an inner lead 2 is provided with a part whose area is smaller than the part 6. In addition, an area which is stuck to the layer 5 of the lead 2 is provided with a part and a bending part whose area smaller than the bonding part, and the part 6 on the tip of the lead 2 is provided with a projecting and recessed part, further the lead 2 is provided with a bending and a projecting and recessed part on the layer 5. Thus, a resin can be prevented from being peeled off from a lead frame during temperature cycle and the breakage of a bonding wire 4 due to cracks caused thereby be eliminated as well. |
