发明名称 Automated direct patterned wafer inspection
摘要 Disclosed is a new self-reference signal processing technique for detecting the location of any nonregularities and defects in a periodic two-dimensional signal or image. Using high-resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution in both directions, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, on the contrary to the existing methods, there is no need for a database image, a scaling procedure, or any apriori knowledge about the repetition period of the patterns.
申请公布号 US5513275(A) 申请公布日期 1996.04.30
申请号 US19940257236 申请日期 1994.06.09
申请人 BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY 发明人 KHALAJ, BABAK H.;AGHAJAN, HAMID K.;KAILATH, THOMAS
分类号 G03F1/00;G06T7/00;(IPC1-7):G06K9/00 主分类号 G03F1/00
代理机构 代理人
主权项
地址