发明名称 |
Automated direct patterned wafer inspection |
摘要 |
Disclosed is a new self-reference signal processing technique for detecting the location of any nonregularities and defects in a periodic two-dimensional signal or image. Using high-resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution in both directions, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, on the contrary to the existing methods, there is no need for a database image, a scaling procedure, or any apriori knowledge about the repetition period of the patterns.
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申请公布号 |
US5513275(A) |
申请公布日期 |
1996.04.30 |
申请号 |
US19940257236 |
申请日期 |
1994.06.09 |
申请人 |
BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY |
发明人 |
KHALAJ, BABAK H.;AGHAJAN, HAMID K.;KAILATH, THOMAS |
分类号 |
G03F1/00;G06T7/00;(IPC1-7):G06K9/00 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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