| 摘要 |
PURPOSE: To form a mirror by cleaving so as to manufacture a semiconductor laser which is easily handled and enhanced in reproducibility. CONSTITUTION: A cleavage starting point 4 is formed adjacent to a mirror forming part of a semiconductor laser by etching the surface of a substrate for each semiconductor laser element 2, parts of the substrate 1 adjacent to the cleavage starting points 4 are locally thinned by cutting grooves 3 and 3A on the rear of the substrate 1, and the semiconductor laser elements 2 are cleaved together with the substrate l. By this setup, mirrors can be formed with a favorable reproducibility and separated for each semiconductor laser element. Furthermore, the grooves 3 and 3A are provided to the rear of a substrate, so that a chip is not required to be totally thinned, and this method of manufacturing a semiconductor laser is applicable to a large substrate. |
