| 摘要 |
PURPOSE: To prevent insufficient bonding of an element due to fluctuation in the depth of lead frame or the height of adhesive being applied or the warp of the element by releasing the suction force of a collet, based on the data of distance to the uppermost surface of the adhesive being applied, at a moment in time when the collet reaches the uppermost surface of the adhesive being applied. CONSTITUTION: An adhesive 5 is applied to an island part of a lead frame 2 and carried to a die bonding position where a die bonding head 7 and a collet 6 are lowered and an element 8 is released from the collet 8 and bonded to the part of the lead frame applied with adhesive. In this regard, a controller 23 controls the collet 6 to release the suction force when the collet 6 is positioned at the uppermost surface of adhesive being applied based on a data of distance thereto being measured continuously by noncontact system at a distance measuring unit 22 using a laser light, for example. |
