MOLD FOR SEALING SEMICONDUCTOR RESIN,申请号JP19940244046-传众专利搜索

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发明名称	MOLD FOR SEALING SEMICONDUCTOR RESIN
摘要
申请公布号	JPH08108455(A)	申请公布日期	1996.04.30
申请号	JP19940244046	申请日期	1994.10.07
申请人	OKI ELECTRIC IND CO LTD	发明人	MURAKI SHINJI
分类号	B29C45/26;B29C45/43;H01L21/56;(IPC1-7):B29C45/43	主分类号	B29C45/26
代理机构		代理人
主权项
地址

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