| 摘要 |
PCT No. PCT/FR93/00032 Sec. 371 Date Aug. 24, 1994 Sec. 102(e) Date Aug. 24, 1994 PCT Filed Jan. 13, 1993 PCT Pub. No. WO93/14136 PCT Pub. Date Jul. 22, 1993.Hardenable or polymerizable epoxy resin-based composition, characterized in that its hardener system comprises a combination in synergic quantities of: (i) at least one imidazole which, alone, can cause the polymerization of the epoxy resin only at a temperature above about 75 DEG C., (ii) at least one polyamine compound which, alone, leads to the polymerization of the epoxy resin at a temperature lower than about 75 DEG C. Such a resin is particularly suitable for the manufacture of composite structures, applicable in particular in ship- or boatbuilding.
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