发明名称 GOLD WIRE FOR BONDING
摘要 PURPOSE: To produce a gold alloy wire excellent in breakage property at the exposure to a heat cycle environment as well as in vibration characteristics, capable of forming a ball shape into perfect sphere, having high bonding strength, and increased in high temp. strength because wire deformation at the time of molding is reduced, in the ball neck part in which the lead frame densely arranged in >=200 pins is bonded and the bonding is carried out under severe conditions by applying reverse deformation at the time of loop forming. CONSTITUTION: A mater alloy, prepared by incorporating, by weight, >0.1-40% Pd and/or Pt, 0.0001-0.003% Eu, and 0.0001-0.003% of at least one element among Be, Ca, Ge, and Sr into a gold metal of >=99.999wt.% purity, is melted and cast in a vacuum melting furnace, subjected to a repetition of cold working by using grooved rolls and a wiredrawing machine and heat treatment, and finished into a fine wire of 30μm final wire diameter and 4% elongation percentage.
申请公布号 JPH08109424(A) 申请公布日期 1996.04.30
申请号 JP19940267310 申请日期 1994.10.31
申请人 TANAKA DENSHI KOGYO KK 发明人 ITABASHI KAZUMITSU;MIMURA TOSHITAKA
分类号 C22C5/02;H01L21/60 主分类号 C22C5/02
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