| 摘要 |
<p>PURPOSE: To obtain a wafer carrier to which all wafers can be sucked and secured in place through a single evacuating operation by making an evacuation hole in one wall face facing a semiconductor wafer set in each of a plurality of grooves made in the opposite side faces facing each other. CONSTITUTION: Wafers 24 are set in all grooves 22 with the rear side directing an evacuation hole 25 made through the wall 23. Since evacuation can not be started when an empty groove 22 is present, a dummy wafer 24 is set in the empty groove 22 thus filling all grooves 22 with wafers 24. When the wafer 24 is cracked or chipped and the evacuation hole 25 can not be closed by the wafer 24, the wafer 24 is removed. Subsequently, a connection piping 32 is coupled with a vacuum pump and a cock 31 is opened to start evacuation. When a wafer carrier is set while directing the evacuation hole upward and the evacuation is started, all wafers in the wafer carrier are sucked thereto and secured in place through a single evacuating operation.</p> |
