| 摘要 |
A package is disclosed that incorporates recessed test vias into a circuit substrate. The test vias are preferably formed at the time of substrate manufacture with little additional cost and offer access to electrical test points after hermetic sealing of the package without competing for lead sites on an otherwise crowded package exterior. The vias are preferably recessed below the surface of the substrate and may be backfilled with insulation to prevent unintended contact. Alternatively, the vias may be incorporated into the side of a package used for mounting to a motherboard, in which case the vias will be sealed at the time of package mounting. In still another instances, the vias may be left accessible or filled with a material that is easily removed for later test and service.
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