发明名称 |
Methods for making circuit boards by vacuum impregnation |
摘要 |
A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
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申请公布号 |
US5512224(A) |
申请公布日期 |
1996.04.30 |
申请号 |
US19900608070 |
申请日期 |
1990.11.01 |
申请人 |
COMPOSITECH LTD. |
发明人 |
MEDNEY, JONAS;KLIMPL, FRED E. |
分类号 |
B32B15/08;B29B15/10;B29B15/12;B29C53/56;B29C53/58;B29C53/76;B29C53/80;B29C70/06;B29C70/10;B29C70/16;B29C70/20;B29C70/34;B29K105/08;B29L9/00;B29L31/34;B32B5/12;B32B5/28;C08J5/24;H05K1/02;H05K1/03;H05K3/00;H05K3/36;H05K3/46;(IPC1-7):B29C39/12;B29C39/42;B29C53/60 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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