发明名称 Methods for making circuit boards by vacuum impregnation
摘要 A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
申请公布号 US5512224(A) 申请公布日期 1996.04.30
申请号 US19900608070 申请日期 1990.11.01
申请人 COMPOSITECH LTD. 发明人 MEDNEY, JONAS;KLIMPL, FRED E.
分类号 B32B15/08;B29B15/10;B29B15/12;B29C53/56;B29C53/58;B29C53/76;B29C53/80;B29C70/06;B29C70/10;B29C70/16;B29C70/20;B29C70/34;B29K105/08;B29L9/00;B29L31/34;B32B5/12;B32B5/28;C08J5/24;H05K1/02;H05K1/03;H05K3/00;H05K3/36;H05K3/46;(IPC1-7):B29C39/12;B29C39/42;B29C53/60 主分类号 B32B15/08
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