| 摘要 |
PURPOSE: To obtain a lightweight and compact semiconductor stack employing an insulation band for facilitating the press contact, while sustaining the press contact force for a long term, by setting a specific relationship between the radius and the thickness of plate at the curved part of the insulation band. CONSTITUTION: In order to retain a resilient press contact force in a semiconductor stack, a predetermined press contact force F is applied by means of a press and then a press rod 15 is lowered until coming into contact with a stopper seat 13 while a lock nut 18 is driven upward until coming into contact with the open surface of a U-shaped block. Although the insulation band 23 is not subjected to tensile force under that state, a tensile force F is applied to the race track type insulation band 23 as a reaction to the press contact force upon removal of the press and fracture due to tensile force is determined, by experiment, at the border of the curved part and the linear part of the insulation band 23. An optimal insulation band could be constituted by setting the radius at the curved part of the insulation band 23 susceptible to the capacity of the semiconductor stack in the range of 2-12 times of the plate thickness at the curved part. |
