Anschlussrahmen für Harz-Halbleiterverpackungen

摘要

Semiconductor chips (2) are mounted on and resin-sealed in island portions (11) of lead frames (1) fabricated from a strip of substrate material (10). The lead frame material (10) is a strip of copper or copper alloy sheet, which has high thermal conductivity, and is spot-clad with metal foils (11) of low thermal expansion by roll-bonding. The foils (11) are located along the substrate at positions opposite where the semiconductor chips (2) are to be mounted, forming island portions (11). Foils (11) may also be spot-clad on the side where the semiconductor chips (2) are to be mounted. Damage to the chips (2) resulting from heating during operation, such as warping or peeling, is thereby effectively prevented.