| 摘要 |
The electronic industry makes use of polyimide substrates with copper coatings which are produced by the decomposition of metal organic compounds by means of a glow discharge process followed by the currentless metallisation of the metal film produced. When the first metal coating is separated, carboncontaining coatings are produced without the addition of oxygen which have low conductivity and little catalytic activity. If only alkaline metallising baths are used, adherent metal coatings are indeed initially deposited on the polyimide surfaces but the adhesion of the metal coating on the polyimide is seriously degraded on contact between the metal and aqueous alkaline solutions. If work is conducted in an oxygen atmosphere, palladium coatings are produced which must subsequently be reduced. Such coatings provide little or no adhesion if they are exposed to chemical or electrochemical process solutions. When mixtures of oxygen-containing compounds and inert gas are used in metal separation in the glow discharge, low-oxygen and carbon coatings are produced. In addition, the reduction in the adhesion on contact between the metallised substrate and aqueous-alkaline solutions can be avoided by the use of acid or neutral currentless metallising baths to produce the second metal coating. This process makes it possible for the first time to produce highdensity circuit carriers from unmetallised polyimide foils.
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