| 摘要 |
A high performance ball grid array is disclosed in which a ball grid array is modified to include a body having a recessed central cavity. The inclusion of a central cavity allows the die to be mounted on the same side of the package in which the solder balls are located. Since the die is mounted on the same side as that of the solder balls, only one set of leads is needed to electrically connect the die to the solder balls, thus requiring only one layer of electrically conductive material within the package, as opposed to conventional ball grid array packages which required two metal layers. In addition, since only one metal layer is needed, the present invention is able to operate without the use of electrically conductive vias. The die is connected via wirebonds to bonding areas located on the package. Each of the bonding areas is substantially co-planar, and each bonding area is located at a different distance from one edge of the central cavity, thereby forming a staggered arrangement. The advantage of positioning the bonding areas in a staggered arrangement is that it enables the spacing between each of the adjacent bonding wires to be maintained, thereby avoiding fan-out of the bonding wires and avoiding the need for multi-level bonding areas in the package. |
