Rapid thermal process and assembly semiconductor wafer tempered

摘要

A rapid thermal process and assembly apply optical treatment to a sensitive esp. electronic component such as semiconductor wafers. The novelty is that the production wafer is tempered while held in position by two thin light-absorbing plates. A transient change in heat is pre-programmed in the active thermal treatment zone as required to achieve the desired thermal conversion. The light-absorbing plate is located at a distance of 1 -10 mm from the production wafer. The treatment is applied in a pre-programmed time-temperature profile.