IMID-EPOXY RESIN AND METHOD FOR PREPARATION THEREOF

摘要

Imid-epoxy resin is synthesized by reaction of bismaleimid with reactant which is obtained through reaction of para-aminophenol with epichlorohidrin in dimethylformamid solvent. In formula(I), R1 and R2 are H or -(CH2)n-CH3 group. The composite resin containing 0.1-20 wt % imid-epoxy resin has an excellent heat-resistance, moisture proof and anti-crack characteristic for sealing purpose epoxy resin of semiconductor. Composite epoxy resin containing 5-50% wt imid-epoxy resin has a good heat-resistance basically.