PARALLEL METAL LINE MEASURING METHOD OF SEMICONDUCTOR DEVICE

摘要

The method for testing life of metal wiring exactly and quickly under wafer state, comprises arranging metal wire(2) in a row to form two metal pads(1), and inspecting electrical characteristics of the metal wire(2) with a probe by providing voltage on the surface of the metal pads(1). Formation of metal pads prevents the metal pass secession generated from measuring for long time at high temperature.