| 摘要 |
A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad. |
