摘要 |
<p>A solder delivery system including a carrier of compliant, dimensionally passive, high-temperature material, the carrier remaining generally dimensionally passive during heating and having a detent therein including fusible material, preferably in the form of a solder paste, positioned therein which is plastically deformable and adhesive-like, the carrier and fusible material together being compliant to conform to objects to be soldered before heating of the system.</p> |
申请人 |
METCAL INC., MENLO PARK, CALIF., US;THE WHITAKER CORP., WILMINGTON, DEL., US |
发明人 |
MCGAFFIGAN, THOMAS, H., HALF MOON BAY, CA 94019, US |