An on-axis through the lens optical alignment system for use in semiconductor manufacturing using step and scan photolithographic techniques. An optical alignment system uses a partially common path with the projection optics (16) optical axis (38) in order to detect alignment targets on a wafer (10) and a mask (20). The relative position of the mask (20) and wafer (10) is detected during a single simultaneous scan, and the mask (20) and wafer (10) are resultantly aligned. This provides advantages over prior art multiple channel off-axis through the lens alignment systems and single channel non-through the lens alignment systems. A detailed optical apparatus (60) is disclosed.
申请公布号
WO9611376(A1)
申请公布日期
1996.04.18
申请号
WO1994US11506
申请日期
1994.10.11
申请人
SVG LITHOGRAPHY SYSTEMS, INC.;GALBURT, DANIEL, N.;WILLIAMSON, DAVID, M.