Polybutadiene and polyisopropene based thermosetting compositions and method of manufacture thereof

摘要

An electrical circuit material is presented which comprises: (a) a thermosetting composition comprising a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer capable of participating in crosslinking with said polybutadiene or polyisoprene resin in an amount of from 25 to 50 volume percent; (b) a woven fabric in an amount from 10 to 40 volume percent; (c) a particulate filler in an amount of from 5 to 60 volume percent; and (d) a free radical cure initiator.