发明名称 |
Mounting arrangement for semiconductor devices |
摘要 |
An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.
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申请公布号 |
US5508476(A) |
申请公布日期 |
1996.04.16 |
申请号 |
US19940217505 |
申请日期 |
1994.03.24 |
申请人 |
PLESSEY SEMICONDUCTORS LIMITED |
发明人 |
DICKENSON, ROBERT J. |
分类号 |
H01L23/12;H01L23/498;H05K3/40;H05K13/04;(IPC1-7):H05K1/18 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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