| 摘要 |
PURPOSE: To prevent a jam of chips, buming, thermal deformation, and the like by heating jetting liquid previously so as to carry out jet machining at the specific temperature in a jet machining method by which a workpiece is cut or perforated by jetting processed liquid from a nodule via a jetting valve. CONSTITUTION: In a synthetic resin base material, which is one of functional materials, for an electronic equipment substrate material or the like, cutting or perforating by means of a cutter, a drill, or the like is carried out. This machining is usually carried out at a high degree of machining such as a number of drill revolutions of 60000-80000rpm and a feeding speed of 30-60μm/rev, so that problems such as a chip jam, burning, and thermal deformation occur. Accordingly, jet machining is carried out after jetting liquid is previously heated to 30 deg.C or more. Either of an inorganic compound and an organic compound is usable for the jetting liquid. In this way, fluidity of the liquid is increased by heating the jetting liquid, and a machining face structure is heated to be softened, and as a result, brittling of the structure and generation of a crack can be prevented.
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