发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: To obtain the subject composition comprising a specific prepolymer and a photochemically acid-generating agent, and capable of giving releaf patterns excellent in heat resistance without deteriorating the sensitivity, because of having the high sensitivity, chemical resistance and heat resistance. CONSTITUTION: This resin composition comprises (A) a prepolymer having vinyl or vinylene groups used as crosslinking points on the side chains and further having functional groups capable of being released to produce hydroxyl groups, and (B) a photochemically acid-generating agent (preferably an onium salt of formula I or II). The component A is preferably the ionic copolymer of a hydroxyl group-protected hydroxyphenylmaleimide derivative of formula III (R<1> is a protecting group capable of being substituted with a hydrogen atom in the presence of an acid catalyst) or a hydroxyl group-protected styrene derivative of formula IV with a monomer having the different kinds of a maleimide group and a vinyl group and represented by formula V. The monomer of formula V is preferably e.g. N-(4-vinylphenyl)maleimide.
申请公布号 JPH08100101(A) 申请公布日期 1996.04.16
申请号 JP19940232958 申请日期 1994.09.28
申请人 HITACHI LTD 发明人 AMO SATORU;NISHIMURA SHIN;TAKAHASHI AKIO
分类号 G03F7/004;C08L33/24;C08L35/00;C08L57/00;C08L57/04;G03F7/039;H01L21/027;H05K3/00;H05K3/06;(IPC1-7):C08L57/04 主分类号 G03F7/004
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