发明名称 |
Semiconductor assembly having laminated semiconductor devices |
摘要 |
A semiconductor assembly comprises first and second containers which contain respective semiconductor chips and are stacked one over another. First and second external leads extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other. The first and the second containers may be provided at corresponding positions with a recess and a projection to be engaged each other for positional alignment. There may be provided first and second heat radiating plates extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other.
|
申请公布号 |
US5508563(A) |
申请公布日期 |
1996.04.16 |
申请号 |
US19940313831 |
申请日期 |
1994.09.28 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TAZAWA, HIROSHI;TAKUBO, CHIAKI;TSUBOI, YOSHIHARU;SASAKI, MAMORU |
分类号 |
H01L23/34;H01L21/48;H01L23/31;H01L23/495;H01L23/50;H01L25/00;H01L25/10;H01L25/11;H01L25/18;H05K1/18;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|