| 摘要 |
<p>PURPOSE: To obtain an IC module with reduced likelihood of dismounting of a pattern small areal portion by forming a non-contact additional etching region from one direction to another of each yoked etching portion along the predetermined press punching out portion in a crossed portion of the predetermined press punching out portion and yoked etching portion. CONSTITUTION: The IC module pattern 4 includes a place for forming an etching portion 7 in a yoked shape toward the pattern outer peripheral portion 4a, that is, yoked etching portions 7a, 7a. Furthermore, additional etching regions 7b, 7b are formed at the intersectional place of a predetermined press punching out portion 32 at the time of separating respective IC module places as an IC package and yoked etching portion (yoked etching portions 7a, 7a). The additional etching regions 7b, 7b are formed in a non-contact relationship toward one direction to another of each yoked etching portion toward the predetermined press punching out portion 32.</p> |
