| 摘要 |
PURPOSE: To obtain a semiconductor device having high connection reliability and a lead frame in which a solder fillet can be formed sufficiently in the vicinity of a bend on the forward end side by forming gull wing type outer leads, for example, having a plurality of bends stably. CONSTITUTION: In the semiconductor device and lead frame the plurality of bends 5a, 5b of a gull wing type outer lead 3, for example, has such cross-section as the inner width is wider than the outer width. This structure stabilizes the shape of the outer lead 3 in the lead frame and a solder fillet is formed sufficiently around the bend 5b when a semiconductor device is mounted on a printed board thus enhancing the connection reliability. |
