发明名称 METHOD OF PROVIDING SPACER ON INSULATED BOARD
摘要 <p>In a method of providing spacers on an insulating substrate, by which spacers the thickness of a connection between an electrical component and a substrate is adjusted, the spacers are rigidly provided on the substrate as a thick film pattern simultaneously with and with the same material as is used for at least one further thick film coating required for an electrical circuit on the substrate.</p>
申请公布号 JPS53135462(A) 申请公布日期 1978.11.27
申请号 JP19780050197 申请日期 1978.04.28
申请人 发明人
分类号 H05K3/34;H01L21/48;H01L21/60;H05K1/09;H05K1/18;H05K3/30 主分类号 H05K3/34
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