发明名称 LEAD FRAME
摘要 <p>PURPOSE:To improve the thermal dissipation performance and to avoid the tab short and open wire due to wire, by adopting the form that tabs are enlarged and the circumference parts are inserted between the clearances of each lead, in a lead frame.</p>
申请公布号 JPS53135574(A) 申请公布日期 1978.11.27
申请号 JP19770049940 申请日期 1977.05.02
申请人 HITACHI LTD 发明人 YOSHIDA HISASHI
分类号 H01L23/50;H01L23/48 主分类号 H01L23/50
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