发明名称 RESISTANCE VALUE ADJUSTING METHOD AND DEVICE THEREOF
摘要 <p>PURPOSE: To conduct a treatment process quickly by a method wherein an etching solution is fed accurately to the part to be etched without flowing out to other part adjacent to the etching part, and the etching solution is adsorved quickly after etching. CONSTITUTION: A syringe 5, containing an etchant, has a pad member 8 on the tip side, the prescribed etchant is fed to a strain gauge element through a needle tube 20. The first process, in which the resistance value of the prescribed part of a strain gauge element is changed, and the second processs, in which the etchant remaining on the strain gauge element is sucked by a sucking means, are conducted in the state wherein the pad member 8 is brought close to the strain gauge element using the shifting means 12 with which the syringe 5 is shifted.</p>
申请公布号 JPH0897019(A) 申请公布日期 1996.04.12
申请号 JP19940252828 申请日期 1994.09.21
申请人 COPAL CO LTD 发明人 NISHIYAMA TAKAAKI;FUJIMOTO YOSHIKI
分类号 B05C5/00;H01C17/24;H01L29/84;(IPC1-7):H01C17/24 主分类号 B05C5/00
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