WIRING STRUCTURE AND IT MANUFACTURE

摘要

PURPOSE: To provide a wiring structure which is high in reliability and low in priced by forming a part of the wiring of the wiring layer of the wiring structure with copper and an insulating layer with a first polyimide having a repeated unit expressed by a specified chemical formula to prevent the elution of copper and generating of cracks in the insulating layer. CONSTITUTION: The wiring of a wiring layer is made up of copper at least in part and at least a part of an insulating layer is made up of a first polyimide obtained by thermally hardening the polyimide precursor composition containing at least polyimide precursor and a basic compound. The basic compound is at least one kind of a quadrivalent organic group selected from formula I and formula II. R<1> in formula I is expressed by formula II and R<2> is bivalent organic group containing an aromatic ring. Thereby, the elution of copper and the crack of the insulating layer are prevented and the mechanical characteristic and the boundary adhesive property are enhanced, so that high reliable products may be provided at a low cost.